Markets Products
IC carrier board
IC carrier board
Packaging substrate, current product types: lead frame, MSAP substrate, PPSmini substrate, used in chip packaging.
![IC载板-1](https://www.pcbbest.com/wp-content/uploads/2024/07/IC载板-1.jpg)
![IC载板-2](https://www.pcbbest.com/wp-content/uploads/2024/07/IC载板-2.jpg)
![IC载板-3](https://www.pcbbest.com/wp-content/uploads/2024/07/IC载板-3.jpg)
![IC载板-4](https://www.pcbbest.com/wp-content/uploads/2024/07/IC载板-4.jpg)
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- 13556897093
- 0755-29877925
- cer@pcbbest.com
- No. 7 and 9, Xinfa 2nd Road, Xinfa Industrial Zone, Xinqiao Street, Baoan District, Shenzhen City